Spin Sonic Cleaner
Simultaneous non-contact cleaning of both sides of the wafer, even for submicron particles.
Introducing the "SpinSonic Cleaner," which achieves high cleaning capability through the adoption of a wafer horizontal placement and sheet-fed fine jet method. It can remove sub-micron particles, reduce the number of processes, and eliminate the need for chemical management and heaters. It demonstrates excellent performance that enables a reduction in cleaning time and savings in running costs. 【Features】 - High cleaning capability achieved with chemical-compatible fine jets and 400kHz fine jets - Maintenance-free and damage-free cleaning through non-contact (brushless) cleaning - Capability to perform all cleaning and drying processes in one stage - No need for heaters due to a completely ambient temperature process, significantly reducing power consumption - Compact installation area and high layout flexibility achieved through function-specific unit configuration *For more details, please refer to the related links or feel free to contact us.
- Company：プレテック 静岡製作所
- Price：Other
